Encapsulation

 

It is the designing and manufacturing of protective packages for integrated circuits. The packaging is commonly ceramic, plastic or epoxy to prevent physical damage and environmental protection; corrosion. Finishing consists of lead trimming, coating and package marking.

 

Apart from the conventional encapsulation methods, liquid encapsulation techniques have also been used extensively in advanced semiconductor packaging, including applications of underfilling, cavity-filling, and glob top encapsulation. However, due to the advanced encapsulation materials and the automatic liquid dispensing equipment involved, it is vital to understand the encapsulation material characteristics, equipment characteristics, encapsulation process development techniques in order to achieve the encapsulation quality and reliability.