Crystal Slicing

 

Wafer or crystal slicing is the cutting of both top and bottom end of the crystal. The ingot is further sliced into shorter sections to enable smooth further slicing. ID (Inner Diameter) and Wire type saws are used for slicing. The sliced wafers will be subsequently lapped to get consistent flatness uniform diameter. Many lapping operations use mixtures of either aluminum oxide or silicon carbide.

 

for quality control and testing. This includes measurement of resistivity, oxygen, carbon, and bulk defects. The whole ingot is then x-rayed to confirm crystal (atomic structure) orientation. Each section is later ground to the specified diameter on a mechanical lathe. A thick "slug" is taken at the end of each ingot