Chemical Vapor Deposition

 

A stage in semiconductor fabrication, Chemical Vapor Deposition (CVD) is a technology to produce thin films; the wafer is put through volatile substance. The latter reacts on the wafer surface, causing a decomposing of gaseous molecules, resulting in a deposit. The newly formed deposit is called the oxide films on the wafer surface.

 

For integrated circuits, polycrystalline silicon is deposited, and up to 650°C is required for the process to take place. Although there are common gases such as Oxygen or Silane are used for the process, consideration has to be given to the thermal stability of the substrate prior to selection.