Diffusion/Implantation

 

Metal layers for contacts and interconnections are deposited onto the wafer. Additional layers in many cases are applied with separating layers of insulators. These various layers are patterned, as needed using the photolithographic process. The vias in the insulated layer provide contact between the metal layers.

 

For performing ion implantation, atoms or molecules are ionized, accelerated in an electric field and implanted into the target material. A wide variety of combinations of target material and implanted ions are possible. The dose of the implanted ions can vary between 1011 and 1018 cm2.