Passivation And Backgrinding

 

Passivation refers to protecting the chip against contamination and increase electrical stability. The IC chips must first be mounted to a platform called the ead frame�. A lead frame consists of a mount for the IC chip and connections for the chip' terminals - leads. An insulating layer is deposited on the surface of the wafer. Vias are opened at the edges of each chip photollithographically to provide access to the leads or

 

bonding pads. Wafer backgrind or thinning refers to grinding the backside of the wafer to the correct thickness prior to assembly.ot always necessary, but the drive to make packages thinner has made it indispensable.