IC Mounting And Die Attachment

 

A step during the packaging stage of semiconductor fabrication, the lead frames with an IC chip mounted are placed on a mold. They are then encapsulated with resin made liquid at high temperature for protection against dust and moisture. Finally the lead frames are cut apart into individual packages.

 

There are two common die attach processes; adhesive die attach and the eutectic die attach.oth processes use special die attach equipment and die attach tools to mount the die. For high-powered applications, the die is usually eutectic bonded onto the package (for good heat conduction). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a printed wiring board) using an epoxy adhesive.