Wire Bonding

 

Generally considered the most cost-effective and flexible interconnect technology, Wire bonding is for making interconnections between microchips. Diameters can start at 15 µm and up to hundreds of micrometeres for high-powered applications. The wires are generally made up of gold, aluminium or copper.

 

Fine wires are attached from each chip’s bonding pads to the leads on the package. The common classes of wire bonding are ball and wedge. In either type, the wires are attached at both ends using some combination of heat, pressure, and ultrasonic energy to make a weld. The chips and the lead frame islands are encapsulated with molding resin for protection, keeping the IC chips from dust and moisture.