Marking,Lead Finish And Decoupling

 

In order to identify the origin of the chip, laser marking onto the package surface has to be done, followed by finishing of leads, and decoupling. Marking is done through engraving the top few micrometers of the package surface with laser, where information such as the manufacturer’s name and country, and product code are engraved. The Data Matrix symbol is currently a standard for marking 300mm wafers.

 

Finishing involves shaping of the leads to enable soldering, resulting in effective function of the IC. Decoupling refers to the separation of the IC s from the lead frame subsequently, leaving each individual ICs in their finished form.