Metals And Process Materials

 

Silver, Gold, Copper and Aluminum are commonly used in semiconductor manufacturing to due their ductility. Used in assembly or packaging processes, Gold is most widespread in wire bonding and resistant to breaking during encapsulation. Silver is used to cover the surfaces of the die pad and bonding fingers of the lead frames of plastic packages to prevent chemical degradation of these areas. Most lead frames for plastic packages are composed of copper, and Aluminum is used as the conductor between components.

 

Silicon is widely used in semiconductor manufacturing; as dielectric in integrated circuits in the form of silicon dioxide, die overcoats, and as main ingredient in plastic encapsulants. Phosphorus, a non-metallic' lement used as a dopant in semiconductor devices.